features ? well defned and smooth spatial radiation patterns ? wide viewing angle ? tinted difused lamp ? high luminous output ? colors: 590/592 nm amber 617 nm reddish-orange 626/630 nm red ? high operating temperature: t jled = +130c ? superior resistance to moisture applications ? trafc management: variable message signs trafc management signs ? commercial indoor/outdoor advertising: signs marquees passenger information ? automotive: exterior and interior lights description these precision optical perform ance alingap leds pro - vide superior light output for excellent readability in sun - light and are extremely reliable. alingap led technology provides extremely stable light output over long periods of time. precision optical performance lamps utilize the aluminum indium gallium phosphide (alingap) technol - ogy. these led lamps are tinted, difused, t-1 3 / 4 packages incorporating second generation optics producing well defned radiation patterns at specifc viewing cone an - gles. there are two families of amber, red, and red-orange lamps; alingap and the higher performance alingap ii. the high maximum led junction tempera ture limit of +130c enables high temperature operation in bright sunlight conditions. these lamps are available in two package options to give the designer fexibility with device mounting. benefts ? viewing angles match trafc management sign requirements ? colors meet automotive specifcations ? superior performance in outdoor environments ? suitable for autoinsertion onto pc boards hlmp-el55/eg55/el57/eh57/ed57 t-1 3 / 4 (5 mm) precision optical performance alingap led lamps data sheet
2 part numbering system hlmp - x x xx - x x x xx mechanical options 00: bulk packaging dd: ammo pack color bin selections 0: no color bin limitation k: amber color bins 2 and 4 only l: amber color bins 4 and 6 only maximum intensity bin minimum intensity bin viewing angle & lead stand ofs 55: 55 deg without lead stand ofs; alingap 57: 55 deg without lead stand ofs; alingap ii color d: 630 nm red g: 626 nm red h: 617 nm red-orange l: 590/592 amber package e: 5 mm round device selection guide for alingap part number color and dominant wavelength l d (nm) typ. [3] luminous intensity iv (mcd) at 20 ma min. [1,2] luminous intensity iv (mcd) at 20 ma max. [1,2] hlmp-el55-gk0dd amber 590 140 400 hlmp-el55-ghkdd amber 590 140 240 hlmp-el55-hjkxx amber 590 180 310 hlmp-el55-jkldd amber 590 240 400 hlmp-el55-lp000 amber 590 400 1150 HLMP-EG55-gk0dd red 626 140 400 HLMP-EG55-hj0xx red 626 180 310 HLMP-EG55-jk0xx red 626 240 400 device selection guide for alingapii part number color and dominant wavelength l d (nm) typ. [3] luminous intensity iv (mcd) at 20 ma min. [1,2] luminous intensity iv (mcd) at 20 ma max. [1,2] hlmp-el57-lp0xx amber 592 400 1150 hlmp-eh57-lp000 red-orange 617 400 1150 hlmp-ed57-lp0xx red 630 400 1150 hlmp-ed57-lpt00 red 630 400 1150 notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package. 2. the optical axis is closely aligned with the package mechanical axis. 3. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the color of the lamp.
3 package dimensions notes: 1. all dimensions are in millimeters (inches). 2. tapers shown at top of leads (bottom of lamp package) indicate an epoxy meniscus that may extend about 1 mm (0.040 in.) down the leads. 3. recommended pc board hole diameters: lamp package without stand-offs: flush mounting at base of lamp package = 1.143/1.067 (0.044/0.042). 2.35 (0.093) max. 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat 8.71 0.20 (0.343 0.008 1.14 0.20 (0.045 0.008)
4 electrical/optical characteristics at t a = 25c parameter symbol min. typ. max. units test conditions forward voltage v f v i f = 20 ma amber ( l d = 590 nm) 2.02 2.4 amber ( l d = 592 nm) 2.15 2.4 red-orange ( l d = 617 nm) 2.08 2.4 red ( l d = 626 nm) 1.90 2.4 red ( l d = 630 nm) 2.00 2.4 reverse voltage v r 5 20 v i r = 100 a peak wavelength l peak nm peak of wavelength of spectral amber ( l d = 590 nm) 592 distribution at i f = 20 ma amber ( l d = 592 nm) 594 red-orange ( l d = 617 nm) 623 red ( l d = 626 nm) 635 red ( l d = 630 nm) 639 spectral halfwidth ? l 1/2 17 nm wavelength width at spectral distribution 1 / 2 power point at i f = 20 ma speed of response s 20 ns exponential time constant, e -t/ s capacitance c 40 pf v f = 0, f = 1 mhz thermal resistance r j-pin 240 c/w led junction-to-cathode lead luminous efcacy [1] v lm/w emitted luminous power/emitted amber ( l d = 590 nm) 480 radiant power amber ( l d = 592 nm) 500 red-orange ( l d = 617 nm) 235 red ( l d = 626 nm) 150 red ( l d = 630 nm) 155 note: 1. the radiant intensity, i e , in watts per steradian, may be found from the equation i e = i v / v , where i v is the luminous intensity in candelas and v is the luminous efcacy in lumens/watt. absolute maximum ratings at t a = 25c dc forward current [1,2,3] ....................................................................................................... 50 ma peak pulsed forward current [2,3] ......................................................................................... 100 ma average forward current [3] .................................................................................................... 30 ma reverse voltage (i r = 100 a) .......................................................................................................... 5 v led junction temperature ......................................................................................................... 130c operating temperature .......................................................................................... C40c to +100c storage temperature ............................................................................................... C40c to +100c notes: 1. derate linearly as shown in figure 4. 2. for long term performance with minimal light output degradation, drive currents between 10 ma and 30 ma are recommended. for more information on recommended drive conditions, please refer to application brief i-024 (5966-3087e). 3. please contact your avago technologies sales representative about operating currents below 10 ma.
5 wavelength ? nm relative intensity 500 600 650 700 1.0 0.5 0 amber red-orange red 550 current ? ma 1.0 0 v f ? forward voltage ? v 2.5 100 40 30 1.5 2.0 60 3.0 10 20 50 red amber 70 80 90 relative luminous intensity (normalized at 20 ma) 0 0 i f ? dc forward current ? ma 40 3.0 2.0 1.5 1.0 0.5 20 60 2.5 i f ? forward current ? ma 0 0 t a ? ambient temperature ? c 40 80 50 40 30 20 10 20 60 100 r ja = 585 c/w r ja = 780 c/w relative intensity ? % 100 0 ? angular displacement ? degrees 80 60 50 70 20 -80 -60 10 30 40 -40 0 20 40 60 80 100 90 -100 -20 figure 2. forward current vs. forward voltage. figure 3. relative luminous intensity vs. forward current. figure 4. maximum forward current vs. ambient temperature. derating based on t jmax = 130c. figure 1. relative intensity vs. peak wavelength. figure 5. representative spatial radiation pattern for 55 viewing angle lamps.
6 bin name min. max. g 140 180 h 180 240 j 240 310 k 310 400 l 400 520 m 520 680 n 680 880 p 880 1150 intensity bin limits (mcd at 20 ma) tolerance for each bin limit is 15%. bin name min. max. 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 amber color bin limits (nm at 20 ma) tolerance for each bin limit is 0.5 nm. note: 1. bin categories are established for classif - cation of products. products may not be available in all bin categories.
7 precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder opera - tion, as the excess lead length also acts as small heat sink. soldering and handling: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? led component may be efectively hand soldered to pcb. however, it is only recommended under un - avoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. note: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profle again before loading a new type of pcb. 2. avago technologies high brightness led are using high efciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250c and the solder contact time does not exceeding 3sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies led confguration 1.59mm soldering the led using soldering iron tip closer than 1.59mm might damage the led. ? esd precaution must be properly applied on the sol - dering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the sol - dering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 105 c max. - preheat time 60 sec max - peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max note: 1) above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2) it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. ? wave soldering parameters must be set and main - tained according to the recommended tempera - ture and dwell time. customer is advised to perform daily check on the soldering profle to ensure that it is always conforming to recommended soldering conditions. note: electrical connection between bottom surface of led die and the lead frame is achieved through conductive paste. ? any alignment fxture that is being applied during wave soldering should be loosely ftted and should not apply weight or force on led. non metal mate - rial is recommended as it will absorb less heat during wave soldering process. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fxture or pallet. ? if pcb board contains both through hole (th) led and other surface mount components, it is recommend - ed that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be sol - dered using refow soldering prior to insertion the th led. ? recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause difculty inserting the th led. allngap device cathode
8 ammo pack drawing 18.00 0.50 (0.7087 0.0197) 6.35 1.30 (0.25 0.0512) 12.70 1.00 (0.50 0.0394) 9.125 0.625 (0.3593 0.0246) 12.70 0.30 (0.50 0.0118) cathode 0.70 0.20 (0.0276 0.0079) 20.50 1.00 (0.807 0.039) a a view a?a ? 4.00 0.20 (0.1575 0.008) typ. all dimensions in millimeters (inches). note: the ammo-packs drawing is applicable for packaging option -dd & -zz and regardless of standoff or non-standoff. example of wave soldering temperature profle for th led refer to application note an5334 for more information about soldering and handling of high brightness th led lamps. 0 30 40 90 100 250 200 150 100 50 time (seconds) preheat turbulent wave laminar wave hot air knife recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin ux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be su ciently cooled to room temperature before exerting temperature (c) 10 20 60 70 80 50 mechanical force.
9 packaging box for ammo packs from left side of box, adhesive tape must be facing upward. avago techno l og i es an od e m o th e r lab el ca t hod e c a + ? anode lead leaves the box first. note: the dimension for ammo pack is applicable for the device with standoff and without standoff. label on this side of box. packaging label: (i) avago mother label: (available on packaging box of ammo pack and shipping box) ( 1 p ) i t e m : p a r t n u m b e r (1t) lot: lot number lpn: (9d)mfg date: manufacturing date ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: refer to below information (9d) date code: date code s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c (1p) part # : part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: refer to below information datecode: date code r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y label
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2014 avago technologies. all rights reserved. obsoletes 5989-4364en av02-1541en - july 18, 2014 disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nucle - ar facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. ( 1 p ) i t e m : p a r t n u m b e r (1t) lot: lot number lpn: (9d)mfg date: manufacturing date ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: refer to below information (9d) date code: date code s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c (1p) part # : part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: refer to below information datecode: date code r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y label (ii) avago baby label (only available on bulk packaging) acronyms and defnition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only
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